KEY TAKE AWAYS

• To define the global 3D IC market
• To measure the global 3D IC and its various sub-segments, technologies, fabrication methods and applications.
• To identify the major driving factors and inhibitors
• To analyze the trends and forecasts of the main market and its segments
• To identify the major stakeholders in the market and draw a competitive landscape for the market leaders
• To analyze the trends and opportunities in major regions, viz. U.S, Europe, and Asia.

Report description

The advances in semiconductor technology brought in the demand for faster and energy efficient interconnects to be used in semiconductor devices. Usually, interconnects face the challenge to meet up the demands for speed for data transfer. In addition, a marginal increase in speed is coupled with a significant increase in the energy requirements and hence results in a higher operating temperature. To meet the extended demands, 3D ICs came as a solution. Two types of 3D ICs were put into the picture- one was heterogeneous in nature and the other is stacked simple 2D ICs. They consume less energy compared to the simple 2D ICs and also are much faster compared to their 2D counterparts. With all the companies in the interconnect market conducting extensive research to improve the performance, 3D ICs will surely be a mainstream technology in the next five years. Though their application in 2009 is limited to only some memory chips and semiconductor technologies, but the companies have plans to implement this technology to more complex products, for example by 2014, the 3D ICs are planned to be integrated in vertical devices on CMOS technology. Considering the huge investments being made, the market will surely hold tremendous potential for the early movers but huge investment for R&D is a compulsion to succeed in this market.

MARKETS COVERED

Our report analyzes in detail the important types of 3D IC structures like heterogeneous and stacked 2D ICs. We have also included in-depth research on the 3D IC technologies and 3D IC fabrication technologies like Beam Recrystallization, Process Wafer Bonding, Silicon Epitaxial growth and Solid Phase Crystallization. This report also discusses the reliability issues of 3D ICs like thermal stability, EMI issues, etc and the advantages that 3D ICs induces in interconnect design and performance. The applications of 3D ICs like CMOS Image sensors, 3D stacked memory, Multicore processors with cache memory, Multi-level 3D IC and Vertical device on CMOS have been included and analyzed in this report. We have done an in-depth geographic analysis for each of the markets and their sub-segments, covering the major regional markets, viz. U.S, Europe, Asia and Rest of the World.

STAKEHOLDERS

The intended audience of this report includes:

• 3D IC manufacturers
• Interconnect manufacturers
• Technology consultants
• Research Labs
• Memory device manufacturers
• Microprocessor design and manufacturing companies

Dummy Tables

Table of Contents

1. Introduction
2. Summary
3. Market Overview
4. 3D ICs structure
    4.1. Heterogeneous
    4.2. Stacked 2D simple ICs
5. 3D IC Technologies
    5.1. Substrate
         5.1.1. SOI
         5.1.2. Bulk Si
    5.2. Bonding Technique
         5.2.1 Die-to-die/die-to-wafer/wafer-to-wafer
         5.2.2 Before or after substrate thinning
         5.2.3 Face-to-face or Face-to-back
         5.2.4 Direct bonding (SiO2)/Bonding with glue, metallic bonding
    5.3. Via realization
         5.3.1 Via first (Preprocess/Midprocess/Post Process)
         5.3.2 Via Last ( After bonding)
6. 3D IC Fabrication Technologies
    6.1. Beam Recrystallization
    6.2. Process Wafer Bonding
    6.3. Silicon Epitaxial growth
    6.4. Solid Phase Crystallization
7. Advantages of 3D IC in interconnect design
    7.1. Reduced timing
    7.2. Improved energy performance
8. Reliability of 3D ICs
    8.1. Thermal issues
         8.1.1. Causes of thermal concerns
         8.1.2. Steps taken to counter the thermal concerns
    8.2. Electromagnetic interference effect
         8.2.1. Causes of EMI effect
         8.2.2. Steps taken to counter the EMI effect
    8.3. Reliability issues
         8.3.1. Electro thermal effect
         8.3.2. Thermo mechanical effect
9. Implications on circuit design and architecture
    9.1. Buffer Insertion
    9.2. Layout of Critical Paths
    9.3. Microprocessor Design
    9.4. Mixed signal ICs
    9.5. Physical design and synthesis
10. Applications
    10.1. CMOS Image sensors
    10.2. 3D stacked memory
    10.3  Multicore processors with cache memory
    10.4 Multi-level 3D IC
    10.5  Vertical device on CMOS
11. Geographic Analysis
    11.1. United States
    11.2. Europe
    11.3. Asia
12. Company Profiles
    12.1. 3D-Plus
    12.2. Allvia
    12.3. Amkor
    12.4. ASE
    12.5. ASET
    12.6. DALSA Semiconductor
    12.7. Elpida Memory
    12.8. EPworks
    12.9. Freescale Semiconductor
    12.10. Hymite
    12.11. Hynix Semiconductor
    12.12. IBM
    12.13. IMEC
    12.14. Intel
    12.15. Irvine Sensors
    12.16. KTH
    12.17. Leti
    12.18. MagnaChip
    12.19. Micron
    12.20. Nanya
    12.21. NEC Electronics
    12.22. NXP Semiconductor
    12.23. OKI Electric
    12.24. Qimonda
    12.25. Renesas
    12.26. RPI
    12.27. Samsung
    12.28. Sanyo
    12.29. Schott
    12.30. Sharp
    12.31. Silex Microsystems
    12.32. Sony
    12.33. Spansion
    12.34. STATS ChipPAC
    12.35. ST Microelectronic
    12.36. Tessera
    12.37. Tezzaron
    12.38. Toshiba
    12.39. Tracit Technologies
    12.40. TSMC
    12.41. VTI
    12.42. Xintec
    12.43. Ziptronix
    12.44. ZyCube
    12.45. Annexes
    12.46. OptoPAC WL-CSP
    12.47. Northrop Grumman
    12.48. MIT TWV realizations
    12.49. Sematech TWI Roadmap
    12.50. 3D IC Database informations
13. Patents
    13.1. U.S Patents
    13.2. Europe Patents
    13.3. Asia Patents

MarketsandMarkets.com publishes about 120 report a year across 10 main industries. The reports are exhaustive reports with about 50 micro markets and product segments, about 80 to 100 market data summary tables, 50 short company profiles, market breakdown upto 5 levels, strategic and competitive landscape, patent overview of more than 300 patents.

MarketsandMarkets.com publishes about 120 report a year across 10 main industries. The reports are exhaustive reports with about 50 micro markets and product segments, about 80 to 100 market data summary tables, 50 short company profiles, market breakdown upto 5 levels, strategic and competitive landscape, patent overview of more than 300 patents.